LDS+ NFC Antenna for Mobile Application
LDS + FPC Antenna
- Common resin materials as following:
- PC (Polycarbonate)
- Electroplating thickness as following:
- Cu = 8+/-2 um
- Ni = 3+/-1 um
- (Au > 0.05 um options)
- NFC Base Material:
- PI Resin
- Electroplating thickness:
- Cu plating ≥ 0.5 OZ
- Ni plating ≥ 1um
- Au plating ≥ 0.03um
- 3M/TESA/ Customized
- Ferrite type:
- S/M, Coverlay
- Black / Customized
- High degree of design flexibility.
- Ability to make products smaller by creating antenna structures on the enclosure.
- Facilitates quick change of antenna layouts easily without expensive tooling changes.
- resins available including popular PC, PC/ABS, ABS materials.
- Offers cost-savings particularly for higher volume applications.