LDS Antenna for Mobile Application
3D-MID LDS Antenna (Customized)
- Common resin materials as following:
- PC (Polycarbonate)
- Electroplating thickness as following:
- Cu = 8+/-2 um
- Ni = 3+/-1 um
- (Au > 0.05 um options)
- Paint thickness as following:
- Color: Customized
- High degree of design flexibility.
- Ability to make products smaller by creating antenna structures on the enclosure.
- Facilitates quick change of antenna layouts easily without expensive tooling changes.
- Resins available including popular PC, PC/ABS, ABS materials.
- Offers cost-savings particularly for higher volume applications.